FIELD: physics.
SUBSTANCE: invention relates to current busbar arrangement (1) for electrical contact with at least one semiconductor module, current busbar arrangement (1) comprises at least two current busbar in at least one area (13) of overlapping arrangement (1) of current busbars (11) are located opposite to each other with overlapping, current busbars are electrically insulated from each other, current busbars have, respectively, at least one web (20) with connecting element (21), web (20) of current busbars are located without overlapping and are oriented so that a first axis can be formed, which passes through connecting element (21) of corresponding web (20) and transition point (19) of corresponding web (20) to area (13) overlapping current bus arrangement (1) and which crosses second axis, which is formed by connection of two connecting elements (21) of web (20), at angle from 0 to 45°, current busbars have insulating region (14), respectively, which is located so that to reduce or prevent current in web (20) in direction perpendicular to second axis. Invention also relates to valve converter module with such current busbar arrangement (1).
EFFECT: reduced interaction between outputs of semiconductor modules.
11 cl, 14 dwg
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Authors
Dates
2019-05-30—Published
2016-11-25—Filed