HERMETICALLY SEALED HOUSING FOR SEMICONDUCTOR DEVICE OR MICROWAVE INTEGRATED CIRCUIT Russian patent published in 2013 - IPC H01L23/55 

FIELD: electricity.

SUBSTANCE: in a hermetically sealed housing for a semiconductor device or an microwave integrated circuit, having a ceramic base, a ring hermetically connected to the housing and a metal cover hermetically adjoining the ring, outer and inner metallised contact pads lying on the periphery on the outer and inner sides of the ceramic base, respectively, and electrically connected in pairs by metal conductors lying inside the ceramic base, the ceramic base is multilayered, and the ring is made from metal; in the central part and outer and inner sides of the ceramic base there are central metallised earthing pads, on the outer side of the ceramic base on the periphery there are also outer earthing metallised contact pads, and a portion of the inner and outer contact pads electrically connected in pairs with each other on the periphery is further electrically connected to the outer earthing contact pads, the central earthing contact pads and the metal ring.

EFFECT: air-tightness of the housing, improved electrical and radiation shielding properties thereof, enabling use of the housing for surface mounting of large-scale microwave integrated circuits with improved technical characteristics and a large number of leads.

3 cl, 2 dwg