METHOD FOR MANUFACTURING HYBRID MICROWAVE INTEGRATED CIRCUITS Russian patent published in 2023 - IPC H01L21/84 H05K3/10 

FIELD: electronic engineering.

SUBSTANCE: invention relates to the field of electronic engineering, and in particular to methods for manufacturing hybrid integrated circuits, such as a microwave generator module. The method for manufacturing a microwave hybrid integrated circuit includes manufacturing individual dielectric layers of a given sequence of a multilayer printed circuit board, with one through hole, manufacturing a given topological pattern of a metallization coating on the front side of each dielectric layer and screen grounding metallization on the reverse side, the lower layer of a multilayer printed circuit board, formation of a through hole in a multilayer printed circuit board by arranging separate dielectric layers with simultaneous alignment of their through holes, their subsequent connection, placement and fixing of the hinged component on the front surface of the upper dielectric layer of the multilayer circuit board, electrical connection, contact of each hinged component with the topological pattern of the metallization coating, control of the electrical characteristics of the hybrid integrated circuit, the alignment of the dielectric layers is carried out along the pins and base holes m, and the connection of the layers of the board is carried out by prepreg, when forming a given topological pattern of the metallization coating on the upper dielectric layer, a screen grounding metallization is made on its reverse side, some of the holes in the multilayer board are metallized, the circuit components are: a coaxial dielectric resonator, generator and control components, forming a voltage-controlled generator, located on the front side of the upper dielectric layer, when forming the upper dielectric layer, under the topological pattern of metallization with generator, control components and a coaxial dielectric resonator, which constitutes the microwave part of the generator circuit, on the reverse side of the upper layer of the multilayer board, the screen is removed grounding metallization, a dielectric resonator is made, with a coaxial output on the end surface and metallization on the side surface, part of the topological pattern of the gene conductors a voltage-controlled rator having capacitive couplings is placed on the end surface of the coaxial dielectric resonator facing the active generator and control components, and electrically connected to the conductors of the topological pattern, and the capacitive couplings are made in the form of gaps, the conductors of the topological pattern of conductors are formed and the conductors connected to them on the end surface of the dielectric resonator in such a way that they coincide with each other at the location, and the connection of the conductors is carried out by attaching the upper ends of the connecting conductors to the lower ends of the conductors of the topological pattern at the end of the dielectric resonator, the coaxial dielectric resonator is installed by metallization of the side surface directly on the metallized platform, the resonator is fixed and electrically connected to the metallized platform of the topological pattern of the upper layer of the multilayer fees; and the metallized area of the topological pattern, with a fixed dielectric resonator, is connected to the screen grounding metallization of the reverse side of the lower layer of the multilayer printed circuit board through the metallized holes, the multilayer board is installed and fixed at the bottom of the metal case with a lid, and the case is sealed by attaching the lid.

EFFECT: improvement of manufacturability, improvement of electrical and weight and size characteristics.

1 cl, 5 dwg