METHOD OF MAKING CERAMIC BASE WITH THIN-FILM MICROSTRIP ELEMENTS Russian patent published in 2020 - IPC H05K3/10 H05K3/32 

FIELD: electronic equipment.

SUBSTANCE: invention relates to electronic engineering, particularly, to manufacturing of semiconductor devices. It is achieved by the fact that in the method of making a ceramic base with thin-film microstrip elements, which includes formation of microstrip lines and contact pads, to which terminals are soldered, contact pads are made of copper with thickness of 1–3 mcm. To the ends of soldered ends, silver 2.5–8 mcm thick is deposited galvanically, which is covered with a layer of titanium with thickness of 0.1–0.3 mcm by vacuum deposition. Ends of terminals are pressed to contact pads and heat treatment is carried out in vacuum until complete transition to soldered copper of contact platform and galvanically deposited silver at ends subject to soldering.

EFFECT: high microwave characteristics of the ceramic base and considerable increase in the strength of external terminals.

1 cl, 3 dwg, 1 tbl