FIELD: physics.
SUBSTANCE: method of assembling laser diode structures (active elements) on a heat-removing base made from boron nitride ceramic involves depositing onto the surface of the heat-removing base a series of metal layers of at least a metal-coating layer and a solder layer, putting the active element onto the metal layer, aligning it relative the base, soldering it while heating in a reducing medium with or without a mechanical load on the element and its subsequent cooling. According to the invention, the first metal-coating layer with thickness of 0.1-0.2 mcm is chemically deposited onto the surface of the heat-removing base by depositing nickel metal from a cured electrolyte with the following ratio of components, in wt %: NiCl2·6H2O - 45-55; NaH2PO2·H2O - 9-13; (NH4)·HC6H5O7 - 60-70; NH4Cl - 45-55. The SnPb (or In) solder layer is deposited through vacuum coating and thickness of the solder layer is selected depending on the size of the laser structures.
EFFECT: simpler assembling process and assembling reproducibility, increased reliability and quality of the contact joint, improved temperature-compensation parametres, and possibility of replacing precious metals used in assembling laser structures on heat sinks.
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Authors
Dates
2010-05-27—Published
2009-04-09—Filed