CASE OF POWERFUL HYBRID ULTRA-HIGH FREQUENCY INTEGRATED CIRCUIT Russian patent published in 2018 - IPC H01L23/02 

FIELD: electronic equipment.

SUBSTANCE: invention relates to electronic engineering and can be used in the manufacture of high-power hybrid ultra-high frequency integrated circuits of increased reliability, sealed by shovel-roller or laser welding. In the case of a powerful hybrid ultra-high frequency integrated circuit, the frame is made of annealed nickel, and the heat sink base is made of molybdenum-copper pseudoalloy with a ledge intended for mounting passive and active hybrid IC elements and having dimensions corresponding to the internal dimensions of the frame, the difference in the dimensions of the protrusion and the corresponding internal dimensions of the frame does not exceed the optimal thickness of the solder.

EFFECT: technical result of the invention is to ensure the hermetic sealing of the body by shearing-roller welding, increase in the temperature of installation of active and passive components of the integrated circuit with solders up to 450 °C and a decrease in the non-flatness of the supporting surface of the heat sink base of the shell.

1 cl, 5 dwg, 9 tbl