FIELD: technological processes.
SUBSTANCE: invention relates to a method of cutting a thin glass layer. Method of cutting a glass layer with a thickness of less than or equal to 0.3 mm, and having a first surface and a second surface comprises advancing a first laser beam, which is generated by a pulsed laser, along a section line, wherein inside the glass layer between the first surface and the second surface, material modifications are created, advancing the second laser beam along the cutting line, wherein the glass layer is heated by laser radiation. Then the glass layer is cooled along the cutting line and the glass layer is cracked along the cutting line. First laser beam is generated by a pulsed laser with pulse duration of less than 1 ps and pulse repetition frequency of 20 kHz to 500 kHz, has wavelength of 300 nm to 500 nm and power of 20 W to 100 W. Modifications of material created by the first laser beam include local sections with high density, which are formed as a result of self-focusing of laser radiation. Focus of the first laser beam is positioned between the first surface and the second surface.
EFFECT: providing smooth edges of the cut, reducing the probability of glass damage with the possibility of creating cutting lines with greater curvature.
12 cl, 3 dwg, 2 tbl
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Authors
Dates
2019-07-09—Published
2016-08-10—Filed