FIELD: cutting devices.
SUBSTANCE: present invention is related to a method and device for controlled separation (cutting) of solid transparent and semi-transparent brittle materials, including hardened and super-hard ones, using the laser filamentation separation (LFS) process, and can be used in production of smartphones, tablets, wearable electronics, as well as in the automotive industry, construction and instrument making. The method includes the quantitative determination of radiation parameters that completely determine the LFS process. A laser device is also proposed in which the irradiation parameters for cutting are set according to their values found in accordance with the mentioned method, taking into account the properties of the material selected for LFS.
EFFECT: improved smoothness of the resulting side walls of separation is achieved, increasing the energy efficiency of LFS, obtaining a high speed of LFS or the ability to perform LFS with a laser beam of very low average laser power (from tenths of a W) obtaining a considerable separation speed acceptable for applications.
21 cl, 13 dwg, 4 tbl, 2 ex
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Authors
Dates
2023-10-31—Published
2022-08-19—Filed