METHOD FOR COMBINED ASSEMBLY OF ELECTRONIC EQUIPMENT AND PRINTED CIRCUIT BOARDS OF RADIOELECTRONIC EQUIPMENT Russian patent published in 2020 - IPC H05K13/04 H05K7/02 H05K1/18 

FIELD: radio engineering; electronics.

SUBSTANCE: invention can be used in production of radioelectronic equipment and radio-electronic devices of critical and household use, including radioelectronic equipment of spacecrafts, which operates under the effect of space conditions, with long periods of active existence. Method is used for simultaneous (joint) mounting of electronic equipment on printed circuit board and printed circuit board with electric and radio products - to housing of device (radioelectronic equipment) by solder paste in one process operation. Soldering of the printed-circuit board with electric radio devices is performed directly to the housing of the device. Soldering by melting solder paste is performed in compliance with required temperature profile of solder paste melting and in accordance with modes allowed (in terms of temperature, time of exposure) by technical conditions for electric radio products and materials of device housing.

EFFECT: reduced labor input and simplified manufacturing of radioelectronic equipment, reduced number of technological operations, weight of radioelectronic equipment, increased reliability of radio electronic equipment under conditions of vibration and mechanical loads, reduced heat load of electric radio products, broader structural capabilities of radioelectronic equipment, high reliability and longer life of radioelectronic equipment manufactured using the proposed method.

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