FIELD: physics.
SUBSTANCE: present invention relates to a method of mechanical contact of a flexible die with a substrate at their accurate alignment, as well as to a method in which said contacting method is used for imprinting a template on a flexible die in a layer on a substrate in which an imprint is made. Disclosed group of inventions includes a method of mechanical contact of a flexible die with a substrate, a computer-readable medium containing computer program code instructions for realizing the method according to any of the preceding claims, a controller for controlling a device for carrying out the method and a device for carrying out any of the methods. At that, method of mechanical contact of flexible die with substrate includes stages, at which: (a) forming, in flexible die, at least partial bulge of die with die bulge section, (b) positioning the flexible die relative to said substrate, wherein the die bulge portion is either a partial bulge portion of the die with a first non-zero distance to the substrate without contact therewith and closer to the substrate than the flexible die portion outside the partial bulge portion of the die, or the full bulge portion die, which is in contact with substrate, (c) measuring transverse alignment between the die bulge portion and the substrate using the flexible die representative element located in the die bulge portion and the substrate characteristic feature located on the substrate, (d) determining the need for crosswise alignment adjustment when fixing the die bulge portion in place, (e) if it is necessary to adjust transverse alignment, transverse adjustment is performed by at least a portion of the convexity of the die relative to the substrate, either holding in place partial section of bulge of die, or after tightening of complete section of bulge of die to partial section of bulge of die and (f) without the need to adjust crosswise alignment or after performing transverse adjustment at step (e), if there is a partial bulge section of the die in place, then the die bulge section is moved in the direction of the substrate to form a complete bulge portion of the die in contact with the substrate.
EFFECT: technical result consists in reduction of induced shift of flexible layer in serial means of SCIL technology, as well as in providing a less complex method, simpler design of substrate holder and equipment for nano-positioning and higher efficiency.
14 cl, 10 dwg
