FIELD: instrument engineering.
SUBSTANCE: invention relates to design and technology of optoelectronic devices. In the method of making a photoconverter on a sintered germanium substrate with output of a rear contact on the front side of the semiconductor structure, according to the invention, which includes: creation on a germanium substrate with grown epitaxial layers of a photoresistive mask with windows for face contacts of a photoelectric converter and a diode, etching of a diode pad, sputtering of layers of front metal coating, removal of photoresist, creation of photoresistive mask with windows under mesa-insulation, etching of meshes, application of protective coating, bleeding of substrate, removal of protective coating, sputtering of layers of rear metallization, annealing of contacts, separating the plate, opening the optical window, spraying the antireflection coating, straightening the photoelectric converter with the built-in diode by cooling in nitrogen, creating an additional mesa-insulated contact pad for outputting the rear contact of the photo converter, laser is used to form recesses under said mesa-insulated contact pad and along perimeter of photoconverter, protective coating is applied by successively forming layers of positive and negative photoresists by centrifugation and quick-drying enamel layer by spraying, gluing the plate with a protective coating on the protrusions of the carrier disc, releasing the substrate to the epitaxial layers in the recesses with simultaneous separation of the plate into the photoconverter chips, etching the epitaxial layers in the recesses, and after sputtering of rear metallization layers, protective coating is removed with simultaneous detachment of photoconverter chips from carrier disc, chips are straightened after annealing of contacts and spraying of antireflection coating.
EFFECT: technical result of the invention is to increase the yield of usable photoconverters on a substrate with thickness less than 50 mcm by eliminating the edge injury factors, in simplifying the technology of electrical connection of external terminals with rear metallization.
1 cl, 5 dwg
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Authors
Dates
2019-10-22—Published
2019-03-04—Filed