SENSOR, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE Russian patent published in 2019 - IPC H01L29/786 H01L21/336 G01L9/08 

Abstract RU 2710383 C1

FIELD: physics.

SUBSTANCE: sensor (100) includes: carrier substrate (101), thin-film transistor (102) (TFT) located on the carrier substrate and including electrode (1025) of the source, first insulating layer (106) located on TFT (102) and comprising first through hole (1071) passing through first insulating layer (106), conductive layer (1031) located in first through hole (1071) and on part of first insulation layer (106) and electrically connected to source electrode (1025) through first through hole (1071), biasing electrode (1032) located on first insulating layer (106) and separate from conductive layer (1031), active reading layer (1033), respectively, connected to conductive layer (1031) and biasing electrode (1032), and auxiliary conducting layer (1034) located on conductive layer (1031). Sensor and its manufacturing method improve conductivity and provide normal signal transmission by arrangement of auxiliary conducting layer (1034) on conducting layer without addition of processes.

EFFECT: sensor, method of its manufacturing and electronic device are disclosed.

20 cl, 4 dwg

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RU 2 710 383 C1

Authors

Lin, Chia Chiang

Dates

2019-12-26Published

2016-09-21Filed