CIRCUIT LAYER FOR A CARD WITH INTEGRATED CIRCUIT Russian patent published in 2020 - IPC G06K19/77

Abstract RU 2725617 C2

FIELD: computer equipment.

SUBSTANCE: invention relates to cards with integrated circuit (IC) and methods of their manufacturing. Disclosed is a circuit layer for an IC card, having an electronic circuit built into the substrate, and a coating which covers the substrate and circuit. In order to enable large tolerances of the circuit position in the substrate, the electronic circuit has quadrangular contact pads, and contact pads are open through the coating by means of holes having a round shape.

EFFECT: technical result consists in reduction of total collimation error.

15 cl, 9 dwg

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RU 2 725 617 C2

Authors

Nielsen, Finn

Dates

2020-07-03—Published

2017-02-28—Filed