FIELD: laser engineering.
SUBSTANCE: invention relates to laser equipment, to scanning pulsed lasers used for cutting brittle substrates. Disclosed are method and device for formation of stressed face in substrate for substrate separation, for which an array of cavities is formed as a result of optical breakdown in the volume of material when it is exposed to a focused laser beam with a fixed focal distance in the process of inclined scanning of the laser beam, with longitudinal displacement along the substrate.
EFFECT: improving strength characteristics of articles and quality of forming a straight or oblique face when separating the substrate, avoiding chips and microcracks, high rate of forming a straining separating face, and laser cutting.
10 cl, 1 dwg
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