FIELD: chemistry.
SUBSTANCE: invention relates to electroplating. Electrolyte for electrochemical deposition of composite copper coating on items of radioelectronic equipment contains copper sulphate, pyrolytic, sulphuric acid and water, wherein it additionally contains ultrafine nanodiamonds in form of 5 % aqueous suspension of ultrafine nanodiamonds, with the following ratio of components, g/l: copper sulphate pentahydrate 70–120; sulfuric acid 160–200; 5 % aqueous suspension of ultrafine nanodiamonds 1.0.
EFFECT: invention can be used for producing corrosion-resistant, wear-resistant coating with reduced porosity and good adhesion in machine building, electronics and other industries.
1 cl, 1 ex
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Authors
Dates
2020-10-13—Published
2019-06-18—Filed