ELECTROLYTE FOR ELECTROCHEMICAL DEPOSITION OF COMPOSITE COPPER COATING FOR RADIOELECTRONICS Russian patent published in 2020 - IPC C25D15/00 

Abstract RU 2734213 C1

FIELD: chemistry.

SUBSTANCE: invention relates to electroplating. Electrolyte for electrochemical deposition of composite copper coating on items of radioelectronic equipment contains copper sulphate, pyrolytic, sulphuric acid and water, wherein it additionally contains ultrafine nanodiamonds in form of 5 % aqueous suspension of ultrafine nanodiamonds, with the following ratio of components, g/l: copper sulphate pentahydrate 70–120; sulfuric acid 160–200; 5 % aqueous suspension of ultrafine nanodiamonds 1.0.

EFFECT: invention can be used for producing corrosion-resistant, wear-resistant coating with reduced porosity and good adhesion in machine building, electronics and other industries.

1 cl, 1 ex

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RU 2 734 213 C1

Authors

Petrova Vera Olegovna

Belov Pavel Anatolevich

Dates

2020-10-13Published

2019-06-18Filed