SOLDERING TAPE Russian patent published in 2021 - IPC B23K35/06 

FIELD: metallurgy.

SUBSTANCE: invention can be used in production of soldered joints, particularly in batch production conditions. Solder tape is made from solder metal powder 1 on organic polymer bond 2 with decomposition temperature of not more than 600 °C. Tape has adhesive coating 3 and protective layers 4 and 5 of the adhesive coating. Protective layer 4 has higher adhesion than layer 5. Solder tape can be reinforced with mesh 6 of synthetic fibres with decomposition temperature of up to 600 °C. Protective layers 4 and 5 of adhesive coating can be made of polymer material, for example, polyethylene. Protective layer 5 can have metric and inch markings. In separate embodiments solder tape can be made with round 7 and rectangular 8 holes or perforated with oval holes 9 and edged with teeth 10.

EFFECT: technical result consists in reducing the assembly labour intensity of soldered joints and reducing the consumption of solder tape.

12 cl, 3 dwg