STRIP OF POWDERED HIGH MELTING POINT SOLDER ON ORGANIC BOND Russian patent published in 2014 - IPC B23K35/22 B23K35/14 

FIELD: chemistry.

SUBSTANCE: strip of powdered high melting point solder on an organic bond contains an acrylic resin polymer and dibutyl phthalate, with the following ratio of components, wt %: powder of high melting point solder 89.0-95.5, acrylic resin polymer 6.6-3.6, dibutyl phthalate 0.9-4.4. To simplify assembling by soldering, said strip can have an adhesive coating of the following composition, wt %: acrylic resin polymer 25-35, dibutyl phthalate 25-35, organic solvent 30-50.

EFFECT: use of the strip enables accurate measurement of the amount of solder required for quality bonding without dry joints and solder leaks, prevents organic bond residues during high-temperature heating to melt the solder and prevents erosion of the solder.

2 cl, 3 tbl