FIELD: electroplating.
SUBSTANCE: invention relates to the field of electroplating, it can be used to produce thin rhenium films, which, after being applied to various substrates, can be used as a sublayer for high-temperature electroplating, for the production of semiconductor elements used in aerospace engineering, radio engineering, electronics and other fields. The electrolyte consists of an aqueous solution containing, g/l: HCl 200-350 and rhenium compound in terms of metal 0.5-10.0.
EFFECT: technical result is the absence of need to introduce additional additives, a low operating temperature range of the electrolyte, reduced resource intensity and environmental load.
1 cl, 1 tbl, 6 ex
| Title | Year | Author | Number |
|---|---|---|---|
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