FIELD: plasma technique.
SUBSTANCE: invention relates to a processing head, a system for processing and a method for processing a local area of a substrate surface using plasma. The head for processing an area of a substrate surface comprises a body with a main surface configured to be placed next to the area of the substrate surface subject to processing and facing said area; an exhaust hole made in the main surface of the body, configured to be connected with the exhaust apparatus by means of a gas exhaust channel formed at least in a part of the body; a radiation heater placed in the body, intended for emitting thermal emission through an emission output hole made in the main surface; a plasma source placed in the body for discharging a plasma jet through a plasma output hole made in the main surface; an outlet in the main surface of the body, configured to be connected with a gas source by means of a gas channel formed at least in a part of the body. The centres of the exhaust hole, the emission output hole, the plasma output hole and the outlet are arranged in the described order along the first direction of the main surface of the body. Also disclosed are a system for processing an area of a substrate surface and a method for processing a local area of a substrate surface.
EFFECT: ensuring efficient surface cleaning.
26 cl, 14 dwg
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