FIELD: resist applying techniques.
SUBSTANCE: invention relates to a technique for applying a resist to semiconductor wafers and can be used for applying a photoresist in semiconductor production in the manufacture of ICs, LSI and VLSI in an automatic cluster photolithography line. The device includes a plate holder with a rotation drive installed in a bath equipped with a pipeline for supplying a cleaning liquid, a photoresist supply nozzle and a solvent supply nozzle, which are mounted on a bracket with the ability to move the latter from the working area of the bath to the non-working area to the support. The stand is made in the form of a cylindrical container with two holes in the cover for installing nozzles and an annular drain threshold in the center of the bottom.
EFFECT: reducing the negative effect of drying photoresist.
1 cl, 4 dwg
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