METHOD FOR CREATING A COPPER COATING ON STEEL FOIL FOR THE RECEIVING PLATE OF A TOKAMAK DIVERTOR Russian patent published in 2022 - IPC C23C14/35 C23C14/38 C23C14/02 C23C14/16 C23C28/02 B32B15/01 B32B15/20 G21B1/13 

FIELD: thermonucleonics.

SUBSTANCE: invention relates to the field of thermonuclear technology and can be used to create a receiving plate of a tokamak divertor based on the concept of the current layer of liquid lithium. A method for creating a copper coating on steel foil for the receiving plate of a tokamak divertor includes placing a sample in the processing zone, creating a vacuum in the processing zone, cleaning the surface with inert gas ions, depositing an intermediate layer of copper in a DC magnetron discharge burning in an inert gas medium at a discharge power of 1.0-2.5 kW, and subsequent creation of a base coating of copper, while cleaning the sample surface with argon ions in the plasma of an abnormal glow discharge at a discharge voltage of up to 700 V, discharge power up to 2.5 kW and an operating pressure of 1.0 Pa for up to 30 minutes, when the sample is heated to a temperature of up to 500°C, the deposition of an intermediate layer of copper is carried out on the surface of the sample heated over 500°C for a period of more than 60 minutes, after which the sample is cooled in argon medium until room temperature is reached, decomposed, the entire surface of the sample with an intermediate layer deposited on it is covered with copper chips, a vacuum is created, the surface of the sample is treated together with the chips in the plasma of an abnormal glow discharge at a discharge voltage of up to 700 V, the discharge power is up to 2.5 kW and the operating pressure is 1.0 Pa for up to 30 minutes, and a base coating of copper with a thickness of up to 10 mm is created by heating a sample coated with copper chips using a heater to the melting point of copper, after which the heater is turned off and the sample is cooled in an argon medium until it reaches room temperature.

EFFECT: invention makes it possible to create a copper coating with good adhesion and resistance to thermal cycling.

1 cl, 2 dwg