FIELD: mechanical engineering.
SUBSTANCE: method includes the following sequence of stages. Substrate (1) is used, passing in a certain plane and containing first layer (2) parallel to a certain plane. A through hole is formed in first layer (2). The second layer is deposited on first layer (2), wherein the second layer fills the through hole to form jumper of material (7). Spiral spring (5) is etched in etching layer (6a) consisting of the second layer or of substrate (1). First layer (2) is removed, while spiral spring (5) remains connected to support element (6b) by means of jumper of material (7). Spiral spring (5) is thermally processed. Spiral spring (5) is separated from support element (6b).
EFFECT: decrease in deformation and improvement of heat exchange during the manufacture of a spring.
19 cl, 9 dwg
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