FIELD: electronic engineering.
SUBSTANCE: invention can be used in manufacturing of miniature parts made of copper, such as miniature retarding systems, vacuum microwave devices. The method includes cutting with an electroerosive wire-cutting machine with a CNC system, chemical cleaning, washing and polishing. Cleaning and polishing of parts is carried out in the following sequence: they are treated in a container with a magnetic stirrer with an etching solution to remove the defective layer of the following composition: NaOH 4-8%, H2O2 8-15%, C10H14N2Na2O8 4-12%, tartaric acid 6-12%, water - the rest, at a temperature of 45-75°C in 1-3 minute cycles with washing in 20% hydrochloric acid and water after each cycle until visible traces of electroerosion disappear, they are treated in a container with a magnetic stirrer with a suspension solution for mechanical polishing containing 2-10% of SiC abrasive powder with a particle size distribution of less than 2 mcm for 2-6 min, then etching is carried out in cycles of 0.5-1 min in a solution for chemical polishing of the following composition: H3PO4 50-70%, HNO3 8-12%, HCl 0.4-1%, CH4N2S 0.07-0.7%, water - the rest, at room temperature until a shine appears on the details, washed with water after each cycle, then the parts are washed in acetone, blown first with dry nitrogen, then with carbon monoxide.
EFFECT: manufacturing high-precision systems of very small sizes for electronic microwave devices with a high class of surface quality by the electrospark method.
1 cl, 4 dwg, 1 tbl, 1 ex
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Authors
Dates
2023-05-29—Published
2022-06-23—Filed