FIELD: instrumentation.
SUBSTANCE: instrumentation for the manufacture of micromechanical devices. Method for manufacturing deep-profile multilevel microstructures is characterized in that the first layer of the protective mask is a metal film, bilateral photolithography includes using an intensity gradient to form the first stage and the second stage in the photoresistive layer of the protective mask; the method of liquid etching in hydrofluoric acid solutions is used as a method of chemical etching of a quartz glass substrate; after the formation of the first level of microstructures, the photoresistive layer of the protective mask is thinned by plasma etching to the depth of the first stage, followed by liquid etching of the first layer of the mask and the formation of the second level of microstructures, to form the third level of microstructures, the photoresistive layer of the protective mask is thinned to the depth of the second stage, and liquid etching of the first layer of the mask and liquid etching of the quartz glass substrate are carried out.
EFFECT: reduction in labour intensity, an increase in dimensional accuracy and workmanship.
10 cl, 5 dwg
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Authors
Dates
2023-10-05—Published
2023-05-26—Filed