FIELD: soldering.
SUBSTANCE: technology for solder sealing of vacuum metal structures with optically transparent elements having an anti-reflection coating (ARC) and can be used, in particular, in the manufacture of sealed housings for photodetectors, including infrared radiation detectors. Parts of the metal structure in the soldering area are tin-coated, preliminary edge metallization of the optically transparent element is carried out, and it is soldered into the metal structure to obtain a hermetically sealed solder joint. Soldering is carried out by heating the metal structure and solder in a high-frequency electromagnetic field until the solder melts and spreads in the joint area along the metallized surface of the optically transparent element. The end of the soldering process is determined by the visually observed boundary of movement of the molten solder on the metallized surface of the optically transparent element, after which the power to the inductor is turned off and the soldering process is stopped.
EFFECT: reduced thermal load on the ARC during the soldering process and improved tightness of the soldered seam with a helium leak rate of 7⋅10-11 Pa⋅m3/s.
1 cl, 2 dwg, 1 tbl
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Authors
Dates
2023-11-08—Published
2022-12-20—Filed