METHOD FOR FORMING EDGE METALLIZATION OF OPTICALLY TRANSPARENT ELEMENTS FOR SEALING VACUUM METAL STRUCTURES BY SOLDERING Russian patent published in 2023 - IPC C23C14/35 B23K1/19 

FIELD: metal processing.

SUBSTANCE: used in the formation of edge metallization of optically transparent elements for their subsequent connection by soldering to metal parts, for example, in the manufacture of sealed photodetector housings. An edge metallization layer is formed on an optically transparent element in the soldering zone by ion cleaning and vacuum magnetron deposition of an adhesive layer and a buffer layer wetted by solder. A passivation layer is applied to the surface of the latter by vacuum deposition of a layer of gold. Ion cleaning and magnetron sputtering of layers are performed in a single vacuum process without depressurization of the vacuum chamber, which makes it possible to remove monolayers of atmospheric gases and water sorbed by the surface, as well as the finest natural oxides and ensures the best adhesion of metal layers to optically transparent elements.

EFFECT: total thickness of the metallization layer exceeds the roughness of the side surface of the optically transparent element, which makes it possible to obtain reproducible soldering results to ensure the weld tightness.

6 cl, 1 dwg, 1 tbl