HEAT-CONDUCTING PANEL FOR LIQUID COOLING SYSTEMS OF DETECTOR MODULES AND METHOD OF ITS MANUFACTURING Russian patent published in 2023 - IPC H05K7/20 

Abstract RU 2806879 C1

FIELD: heat-conducting panel.

SUBSTANCE: heat-conducting panel for liquid cooling systems of detector modules and the method of its manufacture are among the structural elements of the cooling system of modern semiconductor electronics. The heat-conducting panel for liquid cooling systems of detector modules consists of a layered structure in the form of a rigid carbon composite substrate, which is a layer of carbon fiber between two layers of carbon fleece and a heat removal system in the form of polyamide tubes for pumping coolant along the heat-conducting panel. The tubes are covered with a layer of charcoal paper and a layer of charcoal fleece.

EFFECT: invention makes it possible to increase the efficiency of heat removal while maintaining strength and low weight.

2 cl, 5 dwg

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RU 2 806 879 C1

Authors

Lygdenova Tuyana Zorigtoevna

Voronin Aleksej Leonidovich

Zherebchevskij Vladimir Iosifovich

Igolkin Sergej Nikolaevich

Murin Yurij Andreevich

Feofilov Grigorij Aleksandrovich

Dates

2023-11-08Published

2022-06-30Filed