FIELD: various technological processes.
SUBSTANCE: invention relates to a device for sputtering a thin-film coating. Above device includes a vacuum chamber containing a magnetron and ion sources and a heater. Vacuum chamber additionally accommodates a rotating planetary mechanism for placing substrates, a system for controlling the speed and direction of rotation of the planetary mechanism, an encoder and a controller. Encoder is connected to the axis of rotation of the said planetary mechanism. Controller is configured to scan the substrates for a given number of times in front of the magnetron sputtering zone and in front of the ion beam. Encoder output is connected to controller input, and planetary mechanism rotation speed and direction control system is connected to controller output.
EFFECT: reduced roughness and increased texture of coatings – degree of orientation of crystallites in a certain direction.
1 cl, 6 dwg, 2 tbl, 2 ex
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