PACKET STRUCTURE, METHOD OF ASSEMBLING PACKET AND SEMICONDUCTOR DEVICE Russian patent published in 2024 - IPC H01L21/66 

FIELD: semiconductor devices.

SUBSTANCE: use for making semiconductor devices. Essence of the invention consists in the fact that the method of assembling a package of a semiconductor device includes: providing a semiconductor functional structure in which a layer of in-circuit connections is placed on the surface of the semiconductor functional structure; formation of an open part of the insulating layer in the layer of in-circuit connections, wherein the open part of the layer of in-circuit connections performs the function of the first contact pad, and the first contact pad is used for the first type test; formation, after the first type of test, on the first contact pad and the insulating layer of a redistribution layer, wherein the redistribution layer and the in-circuit connection layer are electrically connected; and formation of open parts of first non-conductive layer in redistribution layer, wherein the redistribution layer open parts perform the function of the second contact pad and the third contact pad, wherein the second contact pad is used to perform the second type test, and the third contact pad is used to implement the functional interaction corresponding to the content of the test of the second type; wherein the operating speed of the semiconductor functional structure during the first type test is lower than the operating speed during the second type test.

EFFECT: providing the possibility of carrying out tests of various types at different stages of the process, increasing the flexibility of tests, reducing the production cycle.

10 cl, 16 dwg