FIELD: heating.
SUBSTANCE: invention relates to semiconductor technology and is intended to create a uniform field of temperature gradient in silicon plates and other semiconductor materials during their alloying by thermomigration method. Heating device for thermal migration of liquid zones in silicon plates comprises graphite cylinder installed on two support rods penetrating it. On cylinder side surface in middle part with offset of 20-30 mm from ends heating coil of refractory wire is wound, wherein said graphite cylinder is enveloped by three heat cylindrical shields. Two of said shields cover graphite cylinder side surface free from heating coil while third multilayer shield covers the entire side surface of graphite cylinder. Silicon plates are located vertically inside detachable cassettes in parallel to flat radiating end surfaces of graphite cylinder.
EFFECT: high uniformity of the field of the temperature gradient in silicon wafers, reliability and energy efficiency of the heating device.
1 cl, 3 dwg
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