FIELD: communication devices, memory units. SUBSTANCE: device has conducting-insulating gallium arsenide substrate 1, first non-doped gallium arsenide layer 2, which thickness is and background concentration of donor doping agent is 1014 cm-3, first n-conductance heavily doped layer 3, which thickness is and background concentration of doping agent is 1020 cm-3, third non-doped gallium arsenide layer 4, which thickness is and background concentration of doping agent is 1014 cm-3, second p-conductance heavily doped layer 5, which thickness is and background concentration of acceptor doping agent is 1020 cm-3, second non-doped gallium arsenide layer 6, which thickness is and background concentration of doping agent is 1014 cm-3. In addition device has source areas 7 and drain areas 8, which go down to first non-doped are 2. Galvanic coupling 9 and 10 is provided between gates 11 of adjacent transistors having different conductance in areas of sources and drains as well as between drain 8 of one transistor and source 7 of another one. EFFECT: decreased scattered power, decreased variation in characteristics of inverters over surface of crystal. 1 dwg
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Authors
Dates
1996-06-10—Published
1988-02-04—Filed