FIELD: radioelectronics, electrical engineering. SUBSTANCE: composition is prepared on the base of ultradisperse gold (size of its particles is 1-25 nm) being placed into organic binder. Said binder contains polymethylmethacrylate, acetone and butylacetate. Ratio of components, mass % is: ultradispersed gold 10-35, acetone 15-30, polymethylmethacrylate 0.5-1.0, butylacetate 34.0-74.5. Proposed composition is applied on sublayer with the help of drop method and then is treated by heat within 10 min at 40 C. Yield of desired articles is 98-100% , strength of soldered joint ceramics-monocrystal of silicium is 4.9-7.8 kg/cm2. EFFECT: increases desired articles yield. 1 tbl
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Authors
Dates
1994-06-15—Published
1990-01-23—Filed