PROCESS OF SELECTIVE PRECIPITATION OF MULTILAYER METAL COATS OR INTEGRATED CIRCUITS Russian patent published in 1995 - IPC

FIELD: microelectronics. SUBSTANCE: process includes chemical treatment of plate, application of photoresist on face surface, formation of contact mask by means of photolithography, precipitation of multilayer metal composition from proper aqueous solutions on exposed pattern of integrated circuit, removal of mask. Basic layer composed of amorphous alloy of nickel-palladium-phosphorus is precipitated from nickel-palladium bath with concentration of ions of palladium 0.02-0.12 g-ion/1 at 75-85 C and pH 7.5-8.5. Then another functional layer, for instance of gold, is precipitated to required thickness. EFFECT: facilitated manufacture, improved operational characteristics.