FIELD: electronics. SUBSTANCE: invention relates to technology of manufacture of semiconductor devices. Metallization of electrodes (source, drain and gate) is conducted by chemical selective precipitation from solution through photoresistive contact mask. Coating made of amorphous refractory nickel-palladium-phosphorus alloy which is precipitated from nickel- palladium bath at temperature 96-99 C and pH 9.0-10.0 is used as material of gate. EFFECT: facilitated manufacture.
Title | Year | Author | Number |
---|---|---|---|
PROCESS OF SELECTIVE PRECIPITATION OF MULTILAYER METAL COATS OR INTEGRATED CIRCUITS | 1990 |
|
SU1780458A1 |
SEMICONDUCTOR DEVICE MANUFACTURING PROCESS | 1993 |
|
RU2061278C1 |
METHOD OF MANUFACTURE OF FIELD-EFFECT TRANSISTORS ON THE BASE OF GALLIUM ARSENIDE | 0 |
|
SU1831731A3 |
SEMICONDUCTOR DEVICE MANUFACTURING PROCESS | 1993 |
|
RU2061279C1 |
PROCESS OF MANUFACTURE OF SEMICONDUCTOR DEVICES | 1992 |
|
RU2031479C1 |
METHOD FOR PRODUCING RESISTIVE CONTACTS ON PLANAR SIDE OF STRUCTURE WITH LOCAL REGIONS OF LOW-ALLOYED SEMICONDUCTORS | 1993 |
|
RU2084988C1 |
SEMICONDUCTOR DEVICE MANUFACTURING PROCESS | 1992 |
|
RU2029413C1 |
SEMICONDUCTOR DEVICE MANUFACTURING PROCESS | 1990 |
|
SU1823715A1 |
THE TRANSISTOR ON THE BASIS OF THE SEMICONDUCTING COMPOUND | 2010 |
|
RU2442243C1 |
METHOD OF INCREASE OF CONTROL VOLTAGE ON THE GATE OF THE GAN TRANSISTOR | 2017 |
|
RU2669265C1 |
Authors
Dates
1996-10-20—Published
1992-06-15—Filed