FIELD: photo electronics. SUBSTANCE: anode oxide is grown on semiconductor surface after polishing. Passive dielectric layer with low rate of mercury diffusion is applied on oxide under temperature below 100 C. Depth of layer is not greater than 1000 A. Then device is burnt under temperature of 100-200 C for time which decreases concentration of electric active centers. Then, anode oxide, passive layer and substrate layer near surface are removed. Burning is done in steps lowering its temperature to 100 C, depth d of substrate layer near surface to be removed conform to equation , where Dcd(Ti) is diffusion rate of Cd to CdxHg1-xTe under temperature Ti, ti is burning time for their amount l. EFFECT: increased functional capabilities. 3 cl, 2 dwg
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Authors
Dates
1996-10-10—Published
1989-10-05—Filed