FIELD: semiconductor technology. SUBSTANCE: ions having energy 10- 150 keV and dose CdxHg1-xTe cm are implanted into sample of 1012- 1014 cm-2. of P type structure heated up to 70-170 C. For masking of sample with encapsulating dielectric coat implantation is performed with ions which energy increases by value of energy losses in dielectric. After implantation of ions surface layer of sample with thickness not less than value of path of ions in semiconductor and not greater than value at which concentration of electrons on surface equals 1015- 1017 cm-3. is removed. EFFECT: facilitated manufacturing process. 4 cl, 2 dwg, 1 tbl
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Authors
Dates
1994-11-15—Published
1992-04-27—Filed