FIELD: semiconductor instrumentation engineering. SUBSTANCE: tin dioxide layer with copper admixture is applied to insulating substrate and contacts to layer are made. Tin dioxide layer is applied by vacuum spraying of tin and copper alloy containing 0.05 to 2 atom-percent of copper followed by oxidation of this layer till full oxidation. EFFECT: facilitated procedure. 1 dwg
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Authors
Dates
1994-01-30—Published
1991-06-26—Filed