FIELD: electronics. SUBSTANCE: process includes action of rotating polisher and abrasive compound with viscosity 4-8 1m2 with loading on bonded plates. Lavsan cloth is used as polisher. Polishing of plates is conducted at linear speed of point of polisher coinciding with position of center of cassettes equal to 0.75-1.40 m/s, with consumption rate of abrasive compound not less than 1.2 ml/s per 1.0 sq. m and with pressure of 2.5-5.0 kPa on plates. EFFECT: improved quality of polishing. 1 tbl
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Authors
Dates
1994-02-15—Published
1991-04-16—Filed