FIELD: radio electronics. SUBSTANCE: integrated circuit has dielectric protective shell, chip carrying integrated circuit mounted on chip holder with internal contact pads and external input/output leads arranged on opposite sides of chip holder and interconnected by conductors located on one plane with internal contact pads connected to those of chip by means of wire jumpers; interconnections are partially arranged under chip where they are insulated from the latter by means of dielectric layer. EFFECT: improved design. 2 cl, 5 dwg
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