FIELD: microelectronics. SUBSTANCE: semiconductor devices are manufactured on gallium arsenide plate with active structure by formation of mesa structure, formation of silicon dioxide mask by anodic oxidation, removal of silicon dioxide mask by chemical plasma etching, annealing of anodic oxide protective mask, formation of contact to plate rear side, and deposition of resistive contacts from electrolyte while additionally illuminating the plate. EFFECT: improved quality of resistive contacts. 5 dwg
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Authors
Dates
1995-02-20—Published
1992-05-27—Filed