FIELD: manufacture of integrated circuits. SUBSTANCE: process includes deposition of film of silicon nitride under conditions of HF discharge at room temperature. EFFECT: prevention of growth of tongues.
Title | Year | Author | Number |
---|---|---|---|
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|
RU2040073C1 |
MANUFACTURING PROCESS FOR DOUBLE-LEVEL METALLIZED LARGE-SCALE INTEGRATED CIRCUITS | 1991 |
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RU2584273C1 |
METHOD FOR PRODUCTION OF THIN FILMS OF SILICON DIOXIDE | 1991 |
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METHOD OF PRODUCING SILICON NITRIDE FILM | 0 |
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SU1718302A1 |
METHOD FOR PRODUCTION OF METAL NITRIDE | 1994 |
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METHOD OF MANUFACTURE OF ALUMINIUM NITRIDE-BASED HEAT-CONDUCTING CERAMICS | 1998 |
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RU2083492C1 |
Authors
Dates
1995-04-30—Published
1991-04-04—Filed