FIELD: radio engineering. SUBSTANCE: film capacitor includes first and second plates produced in the form of metal films containing layers of Cu-Cr and dielectric arranged between plates in the form of polyimide film and current leads positioned on opposite side of dielectric. Ratio of thicknesses of metal and polyimide films is chosen within range from 1:1 up to 1:2 and first and second current leads are fabricated in the form of part of metal film protruding above opposite butt sides of polyimide film. Layer of titanium is deposited on layer of chrome sputtered on dielectric. EFFECT: simplified manufacturing technology, expanded application field due to increased precision of reproducibility of small rates of capacitance, decreased inductivity and enhanced merit factor. 2 cl, 1 dwg
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Authors
Dates
1995-10-20—Published
1993-04-26—Filed