METHOD FOR REMOVAL OF POSITIVE PHOTORESISTIVE MATERIAL AND DEVICE FOR IMPLEMENTATION OF SAID METHOD Russian patent published in 1995 - IPC

FIELD: manufacturing of integral circuits. SUBSTANCE: method involves radiation by ultraviolet light and washing in water solution of alkali. New feature of method is that operations of ultraviolet radiation and washing in alkali solution are repeated until film of photoresistive material is completely removed. Corresponding device has reaction chamber where ultraviolet light source is mounted. New feature of device design is substrate holder, which is made as rotating platform with vacuum clamp for fixing chip. Ultraviolet light source is displaced with respect to rotation center and covered with reflector which is mounted over half of chip to be processed. Lower edge of reflector is spaced from surface of chip to be processed. Branch pipe for feeding of water solution of alkali is mounted on outer side of reflector from side of substrate holder center. EFFECT: increased quality of removal photoresistive material due to complete removal of film from working surface. 2 cl, 1 dwg, 1 tbl