FIELD: physics.
SUBSTANCE: non-metal positive photoresist developer contains 1.0-5.0% aqueous solution of tetramethylammonium hydroxide or trimethyl(2-hydroxyethyl)ammonium hydroxide and a fluorine-containing surfactant, at solution pH of not less than 11. The surfactant used is compounds of formula: RfZQA, where for n=3; m=1-3; Z=SO2; Concentration of the surfactant in the solution ranges from 10 to 100 ppm.
EFFECT: non-metal positive photoresist developer based on aqueous solution of organic alkalis and an organofluorine surfactant, which improves the quality of developing a topological structure and uniformity of reproducing feature sizes.
2 cl, 1 tbl, 3 dwg
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Authors
Dates
2013-06-10—Published
2012-02-21—Filed