FIELD: technology of treatment of substrates in vacuum. SUBSTANCE: the essence of the invention consists in that liquid heat-conducting substance is located on bottom plate, and located between substrate and liquid heat-conducting substance is fluoroplastic film 0.05-0.1 mm thick mechanically fastened to substrate holder. Diameter of bottom plate exceeds that of substrate by 1.1-1.3 times. Substrate is located in disk with recess for substrate locking, recess depth equalling 0.5-0.7 thickness of substrate. EFFECT: higher efficiency. 1 dwg
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Authors
Dates
1997-09-10—Published
1993-10-26—Filed