FIELD: radioelectronics. SUBSTANCE: apparatus for cooling substrates in vacuum includes the cooled substrate holder 1, mounted on the water jacket; the mechanical clamps 3 for fixing the substrate 4 on a supporting area of the substrate holder 1 and the heat conductive material 5, placed on the supporting area. The substrate holder has the through opening 6, in which the heat pipe 7 in the form of a disc is mounted. The supporting area coincides with an outer end surface of the disc of the heat pipe. Liquid gallium is used as the heat conductive material. EFFECT: enhanced efficiency of cooling. 2 cl, 1 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| CATHODE JOINT FOR IONIC-PLASMA APPLICATION OF THIN FILMS IN VACUUM | 1992 |
|
RU2074904C1 |
| METHOD FOR VACUUM COOLING OF SEMICONDUCTOR PLATES | 1993 |
|
RU2076390C1 |
| CATHODIC UNIT PREFERABLY FOR PLASMA-BEAM VACUUM DEPOSITION OF THIN FILMS | 1993 |
|
RU2046154C1 |
| DEVICE FOR COOLING OF SUBSTRATES IN VACUUM | 1993 |
|
RU2089654C1 |
| DEVICE FOR APPLICATION OF FILMS IN VACUUM | 1991 |
|
RU2007500C1 |
| DEVICE FOR PLATING IN VECUUM APPARATUSES | 1992 |
|
RU2038416C1 |
| COOLING SYSTEM OF SUBSTRATES IN VACUUM | 1993 |
|
RU2089662C1 |
| DEVICE FOR CONVEYING SUBSTRATES IN VACUUM UNIT | 1992 |
|
RU2020190C1 |
| MANIPULATOR GRIPPER | 1992 |
|
RU2043919C1 |
| DEVICE FOR LOADING EVAPORATORS OF VACUUM SPRAYING EQUIPMENT | 1992 |
|
RU2041288C1 |
