FIELD: defectoscopy. SUBSTANCE: method includes plate scanning by beam of translucent laser radiation on the side of rough surface and recording of diffused radiation passed through face surface of plate. Scanning is performed by radiation with wave length λ > 4a(n-1), where a is characteristic size of surface roughness determined by plate machining quality; n is plate refraction value with beam diameter 
, where λ is translucent radiation wave length, and h is plate thickness. EFFECT: improved check results. 3 dwg
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