FIELD: mechanical engineering. SUBSTANCE: solder in the form of layers of copper 3, silver 4 and second layer 5 of copper is deposited by electroplating in sequence onto entire surface of sample 1 with notch 2. Sample 1 is heated to soldering temperature and subjected to action of axial tension with value less than destruction one. Thickness of solder layers while sample is heated provided for formation of molten copper and silver layer and unmolten layer of copper enveloping the latter on surface of sample. EFFECT: enhanced authenticity. 2 dwg
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