FIELD: microelectronics, in particular, manufacturing of integral circuits. SUBSTANCE: device is designed as transparent plate which is covered with images of chip elements which are preliminary distorted according to alternation of with of photoresist film which is deposited on substrate. Distortion conforms to condition Bi= Boi+(-I)KC[d(r)], where Bi is width of element image on template, Boi is given size of image, K=1 for negative photoresist; K=2 for positive photoresist, C is distortion of image size, d is depth of photoresist film, r is radial coordinate. EFFECT: increased functional capabilities. 2 cl, 3 dwg
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Authors
Dates
1998-06-27—Published
1997-01-06—Filed