FIELD: microelectronics; estimating quality of silicon dioxide layers grown on silicon substrates. SUBSTANCE: changes in readings of film refraction measured by using ellipse metering technique under normal conditions and upon heating structure to 350-400 K are recorded; prior to taking measurements, structure is held in ethyl alcohol at temperature of 320-350 K for 10-15 min. EFFECT: improved sensitivity and proximity of silicon dioxide film inspection for porosity.
Authors
Dates
1999-03-20—Published
1996-07-16—Filed