METHOD FOR FLAW INSPECTION OF SILICON DIOXIDE FILMS ON SILICON SUBSTRATES Russian patent published in 1999 - IPC

Abstract RU 2127927 C1

FIELD: microelectronics; estimating quality of silicon dioxide layers grown on silicon substrates. SUBSTANCE: changes in readings of film refraction measured by using ellipse metering technique under normal conditions and upon heating structure to 350-400 K are recorded; prior to taking measurements, structure is held in ethyl alcohol at temperature of 320-350 K for 10-15 min. EFFECT: improved sensitivity and proximity of silicon dioxide film inspection for porosity.

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RU 2 127 927 C1

Authors

Skupov V.D.

Smolin V.K.

Lashmanov V.V.

Dates

1999-03-20Published

1996-07-16Filed